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Springback calibration of a u-shaped electromagnetic impulse forming process

Journal Article


Abstract


  • A three-dimensional (3D) finite-element model (FEM), including quasi-static stamping, sequential coupling for electromagnetic forming (EMF) and springback, was established to analyze the springback calibration by electromagnetic force. Results show that the tangential stress at the sheet bending region is reduced, and even the direction of tangential stress at the bending region is changed after EMF. The springback can be significantly reduced with a higher discharge voltage. The simulation results are in good agreement with the experiment results, and the simulation method has a high accuracy in predicting the springback of quasi-static stamping and electromagnetic forming

Publication Date


  • 2019

Published In


Citation


  • Cui, X., Zhang, Z., Yu, H., Xiao, X., & Cheng, Y. (2019). Springback calibration of a u-shaped electromagnetic impulse forming process. Metals, 9(5). doi:10.3390/met9050603

Scopus Eid


  • 2-s2.0-85069510580

Volume


  • 9

Issue


  • 5

Abstract


  • A three-dimensional (3D) finite-element model (FEM), including quasi-static stamping, sequential coupling for electromagnetic forming (EMF) and springback, was established to analyze the springback calibration by electromagnetic force. Results show that the tangential stress at the sheet bending region is reduced, and even the direction of tangential stress at the bending region is changed after EMF. The springback can be significantly reduced with a higher discharge voltage. The simulation results are in good agreement with the experiment results, and the simulation method has a high accuracy in predicting the springback of quasi-static stamping and electromagnetic forming

Publication Date


  • 2019

Published In


Citation


  • Cui, X., Zhang, Z., Yu, H., Xiao, X., & Cheng, Y. (2019). Springback calibration of a u-shaped electromagnetic impulse forming process. Metals, 9(5). doi:10.3390/met9050603

Scopus Eid


  • 2-s2.0-85069510580

Volume


  • 9

Issue


  • 5