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Some thermal properties of a copper-tin alloy

Conference Paper


Abstract


  • The thermal properties (heat capacity, thermal diffusivity, and electrical resistivity) of a Cu+10 wt% Sn alloy in both solid and liquid phases have been reported. Using these values it was confirmed that the Lorenz relation is suitable for obtaining thermal conductivity from electrical resistivity in the liquid phase of this alloy. Also, the temperature differential (dλ/dT) obtained from such an approach was in excellent agreement with the thermal conductivity values calculated from thermal diffusivity.

Publication Date


  • 1999

Citation


  • Monaghan, B. J., Neale, J. G. J., & Chapman, L. (1999). Some thermal properties of a copper-tin alloy. In International Journal of Thermophysics Vol. 20 (pp. 1051-1060). doi:10.1023/A:1022694518254

Scopus Eid


  • 2-s2.0-0032594770

Start Page


  • 1051

End Page


  • 1060

Volume


  • 20

Issue


  • 4

Abstract


  • The thermal properties (heat capacity, thermal diffusivity, and electrical resistivity) of a Cu+10 wt% Sn alloy in both solid and liquid phases have been reported. Using these values it was confirmed that the Lorenz relation is suitable for obtaining thermal conductivity from electrical resistivity in the liquid phase of this alloy. Also, the temperature differential (dλ/dT) obtained from such an approach was in excellent agreement with the thermal conductivity values calculated from thermal diffusivity.

Publication Date


  • 1999

Citation


  • Monaghan, B. J., Neale, J. G. J., & Chapman, L. (1999). Some thermal properties of a copper-tin alloy. In International Journal of Thermophysics Vol. 20 (pp. 1051-1060). doi:10.1023/A:1022694518254

Scopus Eid


  • 2-s2.0-0032594770

Start Page


  • 1051

End Page


  • 1060

Volume


  • 20

Issue


  • 4