Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles

Citation

• Lu, C., Tieu, A. K. & Wexler, D. (2009). Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles. Journal of Materials Processing Technology, 209 (10), 4830-4834.

Digital Object Identifier (doi)

• 10.1016/j.jmatprotec.2009.01.003

Scopus Eid

• 2-s2.0-67349274202

Ro Metadata Url

• http://ro.uow.edu.au/engpapers/3679

Has Global Citation Frequency

• 52 (sourced from Scopus)

Number Of Pages

• 4

Start Page

• 4830

End Page

• 4834

Volume

• 209

Issue

• 10

Abstract

UOW Authors

•   Lu, Cheng
•   Tieu, Anh
•   Wexler, David

Publication Date

• 2009

Has Subject Area

• 0913 - MECHANICAL ENGINEERING

Published In

• Journal of Materials Processing Technology  Journal

Citation

• Lu, C., Tieu, A. K. & Wexler, D. (2009). Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles. Journal of Materials Processing Technology, 209 (10), 4830-4834.

Digital Object Identifier (doi)

• 10.1016/j.jmatprotec.2009.01.003

Scopus Eid

• 2-s2.0-67349274202

Ro Metadata Url

• http://ro.uow.edu.au/engpapers/3679

Has Global Citation Frequency

• 52 (sourced from Scopus)

Number Of Pages

• 4

Start Page

• 4830

End Page

• 4834

Volume

• 209

Issue

• 10