Lu, C., Tieu, A. K. & Wexler, D. (2009). Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles. Journal of Materials Processing Technology, 209 (10), 4830-4834.
Lu, C., Tieu, A. K. & Wexler, D. (2009). Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles. Journal of Materials Processing Technology, 209 (10), 4830-4834.