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Dynamic interaction between grain boundary and stacking fault tetrahedron

Journal Article


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Abstract


  • We utilize molecular dynamics simulations to investigate the dynamic interaction between the grain boundary (GB) and the stacking fault tetrahedron (SFT) in bicrystal copper. The grain boundary can migrate itself under the shear strain and can serve as a sink to remove SFT. The sink efficiency of grain boundaries is sensitive to their structural characteristics. The high-angle GBs can show a great ability to remove SFT even at an extreme low temperature, while the increase of temperature can facilitate the annihilation of SFT at the low-angle GBs. This study reveals a new possible GB-mediated damage healing mechanism of irradiated materials.

Publication Date


  • 2018

Citation


  • Zhang, L., Lu, C., Tieu, K. & Shibuta, Y. (2018). Dynamic interaction between grain boundary and stacking fault tetrahedron. Scripta Materialia, 144 78-83.

Scopus Eid


  • 2-s2.0-85030849011

Ro Full-text Url


  • http://ro.uow.edu.au/cgi/viewcontent.cgi?article=1820&context=eispapers1

Ro Metadata Url


  • http://ro.uow.edu.au/eispapers1/819

Has Global Citation Frequency


Number Of Pages


  • 5

Start Page


  • 78

End Page


  • 83

Volume


  • 144

Place Of Publication


  • United Kingdom

Abstract


  • We utilize molecular dynamics simulations to investigate the dynamic interaction between the grain boundary (GB) and the stacking fault tetrahedron (SFT) in bicrystal copper. The grain boundary can migrate itself under the shear strain and can serve as a sink to remove SFT. The sink efficiency of grain boundaries is sensitive to their structural characteristics. The high-angle GBs can show a great ability to remove SFT even at an extreme low temperature, while the increase of temperature can facilitate the annihilation of SFT at the low-angle GBs. This study reveals a new possible GB-mediated damage healing mechanism of irradiated materials.

Publication Date


  • 2018

Citation


  • Zhang, L., Lu, C., Tieu, K. & Shibuta, Y. (2018). Dynamic interaction between grain boundary and stacking fault tetrahedron. Scripta Materialia, 144 78-83.

Scopus Eid


  • 2-s2.0-85030849011

Ro Full-text Url


  • http://ro.uow.edu.au/cgi/viewcontent.cgi?article=1820&context=eispapers1

Ro Metadata Url


  • http://ro.uow.edu.au/eispapers1/819

Has Global Citation Frequency


Number Of Pages


  • 5

Start Page


  • 78

End Page


  • 83

Volume


  • 144

Place Of Publication


  • United Kingdom