Abstract
-
1-3 ceramic/polymer composites based on high Curie temperature ferroelectric ceramic BiScO3-PbTiO3 (BSPT) were fabricated using the dice and fill method. The electromechanical coupling factor k t of BSPT composite was found to be 58% at room temperature, higher than the thickness coupling factor of monolithic BSPT ∼50%. In addition, BSPT 1-3 composite exhibits high thermal stability of electromechanical properties and low dielectric loss up to 300 °C, making it a potential candidate for broad-bandwidth transducer applications at elevated temperatures. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.